Also, why does the electrolyte in electroplating have to contain cations of the metal being plated?
Is it just to ensure the concentration of ions stays constant to ensure an even coating? I really have no clue
Thanks!
Well if you have another kind of ion, you might plate that instead. Your metal cations are what's in contact with the cathode. The plating process itself is a reduction of the metal ions to form solid metal. The ions are the reactants.
Hey guys. I just need a quick refresher on the DNA's primary, secondary and tertiary structure. I know secondary has hydrogen bonds and tertiary has dispersion forces. Please help. It doesn't have to be long, just a quick point about each in terms of being on the exam would be immensely appreciated!
Primary: covalent bonds between atoms, won't break with heat or pH
Secondary: hydrogen bonds between C=O and NH; these can break with heat, responsible for helical structure of DNA
Tertiary: anything else, like electrostatic between protonated amines/deprotonated carboxylate groups, hydrophobic interactions, dipole-dipole interactions etc. These are broken pretty easily